Chiral Raises €10M ($12M USD) to Scale Robotic Nanomaterial Integration for Post-Silicon Computing

Chiral Nano AG (Zurich, Switzerland) has closed a €10 million ($12 million USD) seed funding round to commercialize its proprietary robotic platform for the wafer-scale integration of nanomaterials. Led by Crane Venture Partners, with participation from Quantonation, HCVC, and Founderful, as well as public funding from Innosuisse, the capital will support the company's transition from research-level prototyping to industrial deployment. Chiral’s technology addresses a critical manufacturing bottleneck: the inability to integrate high-performance materials like carbon nanotubes (CNTs) and 2D materials into standard semiconductor fabrication lines without contamination or damage.

The technical core of the platform is the industry’s first robotic nanoassembly system, which utilizes AI and high-precision mechanics to achieve deterministic, selective placement of nanomaterials onto silicon wafers. Unlike conventional liquid-based deposition or chemical transfer methods, Chiral’s approach utilizes mechanical transfer at room temperature, preserving the pristine electrical properties of materials such as graphene, transition metal dichalcogenides (TMDs), and hexagonal boron nitride (hBN). The system currently supports throughputs of up to 1,000 assembly motions per hour with sub-micron alignment accuracy, providing a scalable pathway for high-performance transistors and quantum devices.

This funding milestone positions Chiral within a broader €35 million investment trend in European deep-tech hardware aimed at extending computing performance beyond the limits of Moore’s Law. As industry leaders like TSMC explore nanomaterials for future technology nodes, Chiral is moving into the execution phase, with its first commercial systems scheduled for installation at customer sites throughout 2026. By providing a cleanroom-compatible, automated solution, the company aims to move post-silicon architectures from experimental promise to wafer-scale manufacturability.

Read the official funding announcement from Chiral here.

February 12, 2026